Capabilities
Surface mount, through-hole, test and box build on one floor
The lines, what they place, and what they can handle.
SURFACE MOUNT
The lines
| Stage | Equipment | Capability |
|---|---|---|
| Paste printing | Automatic stencil printers | Fine-pitch stencils, 3D paste inspection inline |
| Placement | Three placement lines | 01005 passives to large BGAs, 40,000 placements an hour |
| Reflow | Ten-zone convection ovens | Lead-free and leaded profiles, nitrogen available |
| Inspection | 3D automated optical inspection, X-ray | Every board, with BGA and QFN voiding checked |
| Board size | Up to 20 x 24 in | Panelized or single, double sided |
AFTER SURFACE MOUNT
Through-hole, coating and assembly
| Process | Capability |
|---|---|
| Selective soldering | Through-hole connectors and power parts without hand touch |
| Hand assembly | Certified operators for odd-form and rework |
| Conformal coating | Acrylic and silicone, selective spray, inspected under UV |
| Cable and harness | Crimped, molded and tested cable assemblies |
| Box build | Enclosures, labeling, firmware load, final test and packing |
On the floor
